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• Environmental (E): The environmental pillar centers on a company鈥檚 impact on the planet. This encompasses the company鈥檚 carbon footprint, efforts to address climate change, responsible chemical usage in manufacturing, and sustainable practices within its business and supply chains.
• Social (S): Social factors revolve around a company鈥檚 relationships with its employees, customers, communities, suppliers, and other stakeholders. This includes labor practices, diversity and inclusion, human rights, and community engagement.
• Governance (G): Governance factors scrutinize a company鈥檚 structure, leadership, and decision-making processes. This includes board diversity, executive compensation, transparency, and anti-corruption measures.

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The following add-on points are included in IMDS version 14.0 as part of this initiative.

Added Recyclate:

路 Chemical Recyclate

路 Bio-Based Content

Added classification:

路 6.x, 7.3 and 9.x

For newly added classifications, IMDS version 14.0 allows you to add recyclate information and source information.

IMDS Recommendation 025 has the following benefits:

鈥� In some countries, companies are required to report recycled and biobased content in order to comply with regulations. The IMDS Recommendation 025 can help companies meet these requirements.

鈥� By using recycled and biobased materials, companies can reduce their environmental impact. Guidelines for identifying and using recyclable and biodegradable materials are provided in IMDS Recommendation 025.

鈥� Business can provide their customers with more information about their products’ environmental impact by reporting their recycled and bio-based content. As a result, companies can build trust with their customers.

There are several drawbacks to IMDS Recommendation 025:

鈥� To comply with IMDS Recommendation 025, data collection can be time-consuming and expensive.

鈥� The IMDS Recommendation 025 can be complex to understand and implement.

鈥� Having insufficient data can make it difficult to accurately assess a material’s recycled and bio-based content.

IMDS Recommendation 025 has some drawbacks, but it is still an important initiative. It can be used by companies to comply with regulatory requirements, improve environmental performance, and improve supply chain transparency.

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The WEEE can be divided into the following categories:

鈥� Hazardous waste is waste that contains hazardous chemicals in certain concentrations.

鈥� POP waste – If the chemicals exceed certain concentrations and are POPs.

A POP is an organic compound that is toxic, persists in the environment, accumulates in food chains, and poses a health and environmental risk. Because of their persistence, these chemicals can be transported far from their sources via air, water, and migratory species. Pollution can occur when POPs are released into water bodies or deposited in soil. Consequently, aquatic life, soil organisms, and ultimately humans are at risk of consuming contaminated water and crops.

Here are some solutions:

鈥� Eco-design principles can reduce hazardous substances.

鈥� To reduce and eliminate POPs in electronic devices, manufacturers, policymakers, consumers, and recycling facilities must collaborate.

鈥� Regulations restricting or banning POPs in electronic devices should be enacted and enforced by the government.

鈥� By increasing public awareness of POP risks, consumers will demand safer and more sustainable electronic devices.

鈥� Research and development should focus on developing safer alternatives to POPs commonly found in electronic devices.

The effects/impacts are as follows:

鈥� POPs negatively impact ecosystems and biodiversity, resulting in population declines and biodiversity losses. Besides affecting human health, it can also cause cancer, developmental disorders, neurological effects, and hormonal disruptions, resulting in thyroid problems, impaired immune function, and metabolic problems.

As a result of their widespread distribution and use, POPs have a significant and widespread impact on human health and the environment. Due to our inability to reduce the production, use, and release of pollutants that harm human health and ecosystems, we must take steps to protect both.

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In the automotive industry, the Part Submission Warrant (PSW) plays a critical role in the Production Part Approval Process (PPAP). PPAP is a standardized process that automotive manufacturers and suppliers use to ensure that all parts and components meet specifications.

PSWs summarize key information about submitted parts in a detailed manner. It includes the materials used, the manufacturing process, and the testing procedure. Additionally, it contains information regarding the manufacturing facility and the production team.

PPAP submissions are represented by the Part Submission Warrant (PSW). In the absence of a customer statement, a PSW is required for all part numbers.

There are several things included in the PSW:

• Describe the reason for submission (i.e., initial submission, engineering changes, parts produced at another location, change in part processing, material source change, annual revalidation, etc.).
• Submission level to the customer (Level 1 to Level 5)
• Declaration of part conformity to customer requirements.
• Authorized supplier person signature along with contact information.
• An area for the customer to indicate the disposition of the PPAP.

PSWs are typically reviewed and approved by both suppliers and customers in the automotive industry. It could be the automotive manufacturer or another supplier in the supply chain. The PSW ensures that the submitted parts meet the specifications and expectations of the customer.

PSW ensures quality and consistency throughout the supply chain as part of the PPAP process. Before full-scale production begins, any potential issues or concerns related to the parts being produced can be addressed. As a result, it can be used as a reference for future issues. In the automotive industry, Part Submission Warrants play a crucial role in ensuring that all stakeholders are aware of what parts are being manufactured. Additionally, it ensures that they meet quality standards.

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Technical team for automotive application classifies electrical components as Integrated Circuits, Discrete Semiconductors, and Passive Components. These three classified components are taken to high level qualification testing such as Stress Test Qualification.

AEC-Qualification standards are categories into AEC-Q100, AEC-Q101 and AEC-Q200 to electrical components. These three standards are commonly used in automotive sectors.

1. ACE-Q 100 represents to Integrated Circuits.
2. AEC-Q 101 represents to Discrete Semiconductors.
3. AEC-Q 200 represents to Passive Components.

Component Classification Maximum Withstand Voltage

Human Body Model (HBM):

1. H0 鈮� 250 V
2. H1A > 250 V to 鈮� 500 V
3. H1B > 500 V to 鈮� 1000 V
4. H1C > 1000 V to 鈮� 2000 V
5. H2 > 2000 V to 鈮� 4000 V
6. H3A > 4000 V to 鈮� 8000 V
7. H3B > 8000 V

ESD Charge Device Model (CDM):

1. C0 鈮� 125 V
2. C1 > 125 V to 鈮� 250 V
3. C2 > 250 V to 鈮� 500 V
4. C3 > 500 V to 鈮� 750 V
5. C4 > 750 V to 鈮� 1000 V
6. C5 > 1000 V

Package Moisture Sensitivity Level (MSL):

1. Level 1 – Unlimited (30鈩� less than 85%RH)
2. Level 2 – 1 year
3. Level 2A – 4 weeks
4. Level 3 – 168 hours (7 days)
5. Level 4 – 72 hours (3 days)
6. Level 5 – 48 hours (2 days)
7. Level 5a – 24 hours (1 day)
8. Level 6 – Mandatory Bake before use

ACE-Q Test Criteria for ESD HBM, CDM and MSL:

1. ACE-Q 100 (Integrated Circuits)

Body Model (HBM): Maximum withstand voltage level 2KV (H2) or better.

Device Model (CDM): Maximum withstand voltage level 500V to 750V (C3) or better.

sensitivity level (MSL): Depends on Components (Level: 1, 2, 2a, 3, 4, 5, 5a, 6)

2. AEC-Q 101 (Discrete Semiconductors)

Body Model (HBM): Maximum withstand voltage level 500V to 1000V (H1A) or better.

Device Model (CDM): Maximum withstand voltage level 500V (C2) or better.

sensitivity level (MSL): Depends on Components (Level: 1, 2, 2a, 3, 4, 5, 5a, 6)

3. AEC-Q 200 (Passive Components)

Body Model (HBM): Maximum withstands voltage level 500V to 8000V (or better).

Device Model (CDM): Not applicable

sensitivity level (MSL): Depends on Components (Level: 1, 2, 2a, 3, 4, 5, 5a, 6)

Electrical package should contain the Material/Performance test result, which is incorporate with AEC-Q standards. AEC qualified standard report shall be included with the detail of ESD (Electrostatic discharge) test result and MSL (Moisture sensitivity level) to all classified electrical component. The ESD has the two types of simulation model as HBM (human-body model) and CDM (Charge Device) Model, which is under tested before and after ESD at room and hot temperature in the range of acceptance criteria. HBM, CDM and MSL has the specific range to select from the AEC-Q standard test report.

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PPAP Process Model with feedback:

Initial Process Studies:

Initial Process Studies is the application of statistical techniques to determine whether the output of the process confirms to the products of service designs.

A process is in control if:

1. No sample points outside limits.
2. Most points near process average.
3. About equal number of points above and below centerline.
4. Points appears randomly distributed.

Initial process Studies:

• Purpose is to determine if production process is likely to produce a product that meet customer requirements
• Initial process capability and performance to be determined for all special characteristics designated by customer or organization
• Customer concurrence to be obtained on Indices for estimating process capability prior to submission ( Cpk, Ppk).
• Initial studies focus on variables and not attribute data
• May be replaced by long term historical data from similar process- customer concurrence needed
• For bulk material 鈥� customer agreement required
• Index>1.67-acceptable
• For Index between 1.67 and 1.33, customer agreement needed
• Index <1.33 currently not acceptable.
• Initial process capability acceptance criteria is only one of a number of requirements that leads to

Process Capability:

Calculate the appropriate statistical metrics in order to determine how the 鈥淰oice of the Process鈥� compares to the 鈥淰oice of the Customer.鈥�

Capability Indices:

• Cp – Relates short term (within subgroup) standard deviation to tolerance. Sometimes called 鈥淓ntitlement,鈥� meaning it is the best the current process can do, if centered
• Cpk – Relates short-term mean & short term (within subgroup) standard deviation to tolerance. Only tells you about the nearest spec limit; doesn鈥檛 tell anything about the other side
• Pp- Relates long term (overall) standard deviation to tolerance
• Ppk – Relates mean & long term (overall) standard deviation to tolerance
• Only tells you about the nearest spec limit; does not tell anything about the other side

Difference between Cp & Cpk:

• Cp 鈥� Determines capability of producing to specification
• Cpk 鈥� Same as Cp, but also measures how centered the process is
• It is important to look at both!

Cpk predicts capability

• Based on short term within subgroup variation
• Does not include the effect of process variability between subgroups

Cpk should be used when:

• Developing new parts
• Revising specifications on a part
• Materials, processes, manufacturing location, or equipment have significantly changed
• Material suppliers have changed (include certificate of analysis)

Ppk indicates past performance:

• Based on long term total variation
• Unlike Cpk, Ppk is not limited to variation within subgroups
• However, Ppk cannot isolate within subgroup variation from between subgroup variation
• When calculated from the same data set, Cpk and Ppk can be compared to analyze the sources of process variation

Ppk should be used when:

• The supplier is new to customer , but has already been manufacturing a part
• The supplier is existing, but has produced a number of nonconforming parts

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In the 1980s automotive giants such as General Motors (GM), Chrysler and Ford majorly implemented APQP. After realizing the benefits of APQP in their organizations they came together to form a common platform and standardized the entire APQP process in supply chain.

What is APQP?

The complexity involved in building an automotive product increases the occurrence of errors in the manufacturing process. Taking manufacturing of vehicle as an example 鈥� producing a vehicle includes thousands of parts; way from small screws to big frames. Each of these parts may not have been built by single manufacturer. In order to ensure the quality throughout the supply chain there should be a well-built monitoring methodology and APQP is such methodology, which facilitates the minimization of errors.

APQP is a set of procedures that documents the capability, reliability & repeatability of the process throughout the risk assessment.

APQP along with , FMEA, MSA and SPC forms five core tools, which ensures the streamlined quality management system throughout the IATF 16949 adhering industries.

When is APQP necessary?

APQP is required to develop/introduce a new product when the OEM and its suppliers are working together. APQP can be used while modifying the product or process changes after release.

What is the purpose of APQP?

• To provide guideline designed to produce a product quality plan
• Supports development of a product that satisfies requirements of the customer
• Reduction of complexity of product development planning
• Easy communication of product quality planning requirements to suppliers

The Cross Functional Team (CFT) takes care of APQP process implementation in any organization. APQP usually consists of members from Engineering, Product Development, Operation, Purchasing, Marketing and other functions with a team lead.

Benefits of APQP

• Better quality product through collaboration
• Catch risks earlier in the lifecycle to minimize delays
• Consistent production runs with better lead times
• Validation ensures product conformity across multiple suppliers
• Suppliers are given better direction and expectations before cutting metal

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• The inadequate samples to study the capability would lead to uncertainty. Failure to conduct the Statistical Process Control study may result in defective/NG parts reaching the customer.
• Cost is one of the most important challenges any organization faces to acquire right manufacturing equipment to meet stringent product specifications. Inadequate infrastructure to launch modified product may not help meet the Customer Specific Requirements (CSR).
• Generally, cost associated with PPAP documentation will not be in contractual agreement, this is an additional cost, which an organization has to bear.
• Failure to produce required level of PPAP
• Resubmission of PPAP after the engineering change is difficult. Sometimes, PPAP is not prepared for the changes made in the 4M, due to which engineering changes are not communicated to the downline departments.
• Inability to capture all details in the Process Flow of a product development process. Special characteristic (Product and process critical characteristics) might not be identified as required. This leads to failure of Fit, Function and Safety.
• Control on special characteristics is challenging and so does the obtaining process capable index.
• DFMEA/PFMEA/Control Plan preparation may not involve the Cross Functional Team (CFT) members.
• Delay in PPAP submission: Failure to produce PPAP in-time: The product is in urgent need and marked so but the supplier fails to test and prepare the PPAP documents in-time would result in product disruptions. There are many reasons for delayed submission of PPAP such as:
  • Lack of awareness on PPAP process.
  • Customer specific requirements not apprehended fully by the organization.
  • Supplier is unaware of end user or testing requirements. Hence, even after the PPAP approval, product might get rejected.
  • Capturing the ECN changes not in line with the all documents.

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Here is list of changes in the IMDS 13.0

• Deactivation of IMDS Recommendation 019 Semi-Component Material Data Sheets: With IMDS release 13.0, the published Recommendation 019 (Semi-Component MDSs) is going to be deactivated (Company ID: 102677 / Name: ZVEI-Rec019). Due to deactivation of Rec019 in release 13.0, the electronic companies face a major challenge, and it doesn’t seem that all OEMs will require legacy data sheets to be updated. The changes are only applicable to new product releases, legacy data is not affected.
• Deactivation of Material Classifications 8.x: Once the IMDS 13.0 is released, the Material classifications – 8.1 Electronics (e.g. pc boards, displays) and 8.2 Electrics are deactivated.
• Deactivation of other Material Classifications: In accordance with the Release 13.0 guidelines and the update of Recommendation IMDS001a, below are the Material classifications that are also deactivated.
  • 1.2 Cast iron
  • 5.4 Duromers
  • 5.5.1 Plastics in polymeric compounds
• Adding new attributes and interface to transfer MDSs one by one to : There are few attribute fields that are introduced for newly created components:
  • Article category / Taric codes
  • Production in EU
  • Safe use instructions required (yes/no)
  • Safe use instructions
  • SCIP number
  • SCIP submission number
• Similarly, for newly created materials the subsequent new attributes are also introduced:
  • Material category
  • Additional material characteristics
• Support for multi-sourcing: The current scope of this enhancement applies to components solely. It will be attainable to refer & compare multiple MDSs for one component if it has multiple suppliers鈥� submissions, which will solve the problem of deciding the way to handle a multi-sourcing situation in IMDS.
• Increased precision for portions: Currently, the smallest portion that can be entered for substances in IMDS is up to six decimal places, and the smallest unit of weight is micrograms. To declare substances with very low thresholds like PFOA, it is typically not possible to enter more than 6 decimal places. However, now this issue is additionally resolved as the maximum number of point digits in portions is increased from 6 to 9 and the smallest allowed unit of weight can be entered as nanograms.
• Consideration of the Lower Threshold for available selection of Application Codes: The Application Codes for material will not be displayed if the lower threshold is not met. The only exemption is Application Code 8(e) 鈥� Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead), it鈥檚 not applicable for this.
• Threshold parameter for every Where-Used Analysis associated with substances: An additional threshold parameter (from / to) value is introduced to help the user who wants to do an analysis on the threshold limit of prohibited substances. Users can give any range in the 鈥淲here-Used Analysis Tool鈥� and check for the threshold limit once using the below type of analysis:
  • Substance
  • Substance list
  • Substance group
  • GADSL/SVHC
  • Application code
• Changes in IMDS SC 90 checks: As in agreement by the IMDS Steering Committee and supplier representatives, to keep the material classification of the base material in composites, the threshold limit is set to 鈮� 5 % of the base material for the classifications 5 -Polymer Materials and 6-Process Polymers.
• Few Other changes to the IMDS-AI interface:
  • Confidential Substances added to or GADSL
  • SCIP Substance Mapping file
  • Re-establishment of certain default application code
  • Change of recycle handling for polymer materials
  • for different classifications

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